Method and structure for measuring circuit offset by using circuit substrate
The invention discloses a method and a structure for measuring circuit offset by using a circuit substrate. Electrical measurement is performed on a first detection circuit and a pair of second detection circuits by using a plurality of matched drilling holes which are intentionally formed along a Y...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a method and a structure for measuring circuit offset by using a circuit substrate. Electrical measurement is performed on a first detection circuit and a pair of second detection circuits by using a plurality of matched drilling holes which are intentionally formed along a Y axis and an X axis in an offset way respectively, so that off positions, which are drilled off by the drilling holes, of the first detection circuit and the second detection circuits are acquired; actual circuit offset along the Y axis and the X axis of the first detection circuit and the second detection circuits are converted through the off positions; therefore, exposure offset when a circuit pattern is formed by mask exposure is extrapolated, and the improvement on the measurement efficiency and the measurement accuracy of the circuit offset are facilitated. |
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