Photoelectric module for processing image signal and method for manufacturing same

The invention discloses a photoelectric module for processing an image signal and a method for manufacturing the same. The photoelectric module comprises a wafer, a transparent cover plate, an interstitial and non-light-transmitting sealing glue, wherein the wafer comprises an image signal processin...

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1. Verfasser: GU SHUNYAN
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention discloses a photoelectric module for processing an image signal and a method for manufacturing the same. The photoelectric module comprises a wafer, a transparent cover plate, an interstitial and non-light-transmitting sealing glue, wherein the wafer comprises an image signal processing area; the transparent cover plate is arranged above the wafer and comprises a dent, and the dent surrounds the periphery of the transparent cover plate; the interstitial is arranged between the wafer and the transparent cover plate and is used for forming a preset gap between the image signal processing area of the wafer and the transparent cover plate and fixing the transparent cover plate above the wafer; and the non-light-transmitting sealing glue is used for encircling the wafer and the transparent cover plate and filling in the dent, a light-transmitting area is limited to the dent filled with the non-light-transmitting sealing glue, and the light-transmitting area corresponds to theimage signal processing a