Vacuum ion plating process

The invention relates to the technical field of electroplating, in particular to a vacuum ion plating process. The vacuum ion plating process is characterized in that cobalt-chromium alloy is selected as a target material and the plating process is completed in a vacuum environment, wherein the vacuum degree of the vacuum environment is required to be 0.2-0.9Pa, the temperature is 0-300 DEG C, the target current is 0-100A, the pulse bias voltage is 0-200V, and a reactant gas is argon; and the cobalt-chromium alloy target material is composed of the following components by weight percent: 40-85% of cobalt, 10-55% of chromium and the balance of trace element, wherein the trace element is one or more of molybdenum, nickel, iron, carbon, manganese, silicon, nitrogen, titanium, copper, aluminum and vanadium. The vacuum ion plating process is simple, scientific and reasonable, and is easy and convenient to operate, thus greatly improving the operation ratio and the maneuverability of the vacuum ion plating, caterin