Water-rich stripping and cleaning formulation and method for using same

Water-rich formulations are used to remove bulk photoresists, post-etched and post-ashed residues, residues from A1 back-end-of- the-line interconnect structures, and contaminants. The formulation comprises: hydroxylamine; corrosion inhibitor containing a mixture of alkyl dihydroxybenzene and hydrox...

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Bibliographische Detailangaben
Hauptverfasser:	LEE YIIA, WU AIPING, BANERJEE GAUTAM, RAO MADHUKAR BHASKARA, WIEDER THOMAS MICHAEL, LIU WEN DAR
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES APPARATUS SPECIALLY ADAPTED THEREFOR CANDLES CHEMISTRY CINEMATOGRAPHY DETERGENT COMPOSITIONS DETERGENTS ELECTROGRAPHY FATTY ACIDS THEREFROM HOLOGRAPHY MATERIALS THEREFOR METALLURGY ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS RECOVERY OF GLYCEROL RESIN SOAPS SOAP OR SOAP-MAKING USE OF SINGLE SUBSTANCES AS DETERGENTS
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Beschreibung
Zusammenfassung:	Water-rich formulations are used to remove bulk photoresists, post-etched and post-ashed residues, residues from A1 back-end-of- the-line interconnect structures, and contaminants. The formulation comprises: hydroxylamine; corrosion inhibitor containing a mixture of alkyl dihydroxybenzene and hydroxyquinoline; an alkanolamine, a water-soluble solvent or a combination of the two; and at least 50% by weight of water.