Support mounted electrically interconnected die assembly

Stacked die assemblies are electrically connected to connection sites on any support, without electrical connection to an interposed substrate or leadframe, and without solder.

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Bibliographische Detailangaben
Hauptverfasser:	ROBINSON MARC E, ANDREWS LAWRENCE DOUGLAS JR, MC ELREA SIMON J. S
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	Stacked die assemblies are electrically connected to connection sites on any support, without electrical connection to an interposed substrate or leadframe, and without solder.