Micro electro mechanical system structure and manufacturing method

The invention provides a micro electro mechanical system structure. A substrate is provided with a microstructure and an etching channel; the microstructure is formed by connecting metal layers and conductive layers; silicon oxide is coated around the microstructure, and the top of the silicon oxide is provided with a barrier layer; the etching channel is formed by interactively stacking metal layers and oxide layers, and both sides of each oxide layer are provided with channels; the barrier layer of the microstructure is not coplanar with the metal layer on the topmost layer of the etching channel; and when the metal layers of the etching channel are removed by etching, the metal layers of the microstructure cannot be simultaneously removed. The invention also provides a micro electro mechanical system manufacturing method. The method comprises the following steps of: removing the metal layers in the etching channel by a wet etching method; removing the residual oxide layers in the etching channel by shaking