Semiconductor encapsulation structure and manufacturing method thereof

The invention relates to a semiconductor encapsulation structure and a manufacturing method thereof. The semiconductor encapsulation structure comprises a base plate, a first chip, a plurality of copper wires, protection glue, a supporting material and a second chip, wherein the base plate comprises a plurality of first welding pads; the first chip comprises a plurality of second welding pads andis arranged on the base plate; the copper wires are electrically connected with the first welding pads and the second welding pads; the protection glue completely coats the copper wires, the first welding pads and the second welding pads or the protection glue only coats the first welding pads and first wire ends of the copper wires; the supporting material is arranged on the first chip; the second chip is arranged on the supporting material; and encapsulation glue coats the first chip, the protection glue, the supporting material, the second chip and the copper wires.