Slider bond pad with a recessed channel

A slider includes a slider body and a bond pad. The bond pad is positioned on the slider body and has a bonding surface with a recessed channel for directing solder flow.

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Bibliographische Detailangaben
Hauptverfasser: HUTCHINSON ERIK JON, UNGER CHRISTOPHER MICHAEL
Format: Patent
Sprache:chi ; eng
Schlagworte:
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Beschreibung
Zusammenfassung:A slider includes a slider body and a bond pad. The bond pad is positioned on the slider body and has a bonding surface with a recessed channel for directing solder flow.