Flat plate type oxygen sensor chip structure and manufacturing method thereof
The invention aims at providing a flat plate type oxygen sensor chip structure which structurally omits an air chamber layer structure and a manufacturing method thereof so as to greatly simplify the process, eliminate the reduction of the overall strength caused by the hollow structure of the air c...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention aims at providing a flat plate type oxygen sensor chip structure which structurally omits an air chamber layer structure and a manufacturing method thereof so as to greatly simplify the process, eliminate the reduction of the overall strength caused by the hollow structure of the air chamber layer, prolong the service life and eliminate the potential failure trouble caused by leakage of the air chamber. The flat plate type oxygen sensor chip comprises a protective layer, a sensitive element layer, a reference layer and a heating layer, wherein the reference layer is a thin layer, is made of composite ceramic materials and is used for replacing the air chamber of the traditional flat plate type oxygen sensor; and the heating layer is bonded with the heating structure of the traditional preferred flat plate type oxygen sensor. The manufacturing method comprises the following steps: taking a solid reference oxygen partial pressure material for the reference layer, and printing on a heating layer bl |
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