Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method

Disclosed is an aqueous dispersion for chemical mechanical polishing, which contains silica particles (A) and an organic acid (B1). The silica particles have such chemical properties that the sodium, potassium and ammonium ion contents determined by the elemental analysis by ICP emission spectrometr...

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Bibliographische Detailangaben
Hauptverfasser:	IKEDA MASATOSHI, SHIMIZU TAKAFUMI, TAKEMURA AKIHIRO, KUBOUCHI SHOU, SHIBATA YOUSUKE, UCHIKURA KAZUHITO, SHIDA HIROTAKA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DRESSING OR CONDITIONING OF ABRADING SURFACES DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PERFORMING OPERATIONS POLISHES POLISHING POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH SEMICONDUCTOR DEVICES SKI WAXES TRANSPORTING
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Beschreibung
Zusammenfassung:	Disclosed is an aqueous dispersion for chemical mechanical polishing, which contains silica particles (A) and an organic acid (B1). The silica particles have such chemical properties that the sodium, potassium and ammonium ion contents determined by the elemental analysis by ICP emission spectrometry or ICP mass spectrometry and the quantitative analysis of ammonium ions by ion chromatography are as follows: the sodium content is within the range of 5-500 ppm; and the content of at least one of potassium and ammonium ions is within the range of 100-20,000 ppm.