Ic chip package and forming method

Ic chip package and forming method

A structure includes a solder element for electrically coupling a substrate of an integrated circuit (IC) chip package and a printed circuit board (PCB); and a first electrical property altering, substantially planar member positioned between the solder element and at least one of a landing pad of t...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: BEHUN J. RICHARD, STONE DAVID B
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A structure includes a solder element for electrically coupling a substrate of an integrated circuit (IC) chip package and a printed circuit board (PCB); and a first electrical property altering, substantially planar member positioned between the solder element and at least one of a landing pad of the substrate and a landing pad of the PCB. In another embodiment, the electrical property altering, planar member can be applied to the solder element(s) between the IC chip and the package substrate.