Ic chip package and forming method

Ic chip package and forming method

The present invention relates to an IC chip package and a forming method. A structure includes a solder element for electrically coupling a substrate of the integrated circuit (IC) chip package and a printed circuit board (PCB); and a first electrical property altering, substantially planar member p...

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Hauptverfasser: BEHUN J. RICHARD, STONE DAVID B
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator BEHUN J. RICHARD
STONE DAVID B
description The present invention relates to an IC chip package and a forming method. A structure includes a solder element for electrically coupling a substrate of the integrated circuit (IC) chip package and a printed circuit board (PCB); and a first electrical property altering, substantially planar member positioned between the solder element and at least one of a landing pad of the substrate and a landing pad of the PCB. In another embodiment, the electrical property altering, planar member can be applied to the solder element(s) between the IC chip and the package substrate.
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A structure includes a solder element for electrically coupling a substrate of the integrated circuit (IC) chip package and a printed circuit board (PCB); and a first electrical property altering, substantially planar member positioned between the solder element and at least one of a landing pad of the substrate and a landing pad of the PCB. 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RICHARD ; STONE DAVID B</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN101930960A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2010</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>BEHUN J. RICHARD</creatorcontrib><creatorcontrib>STONE DAVID B</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>BEHUN J. RICHARD</au><au>STONE DAVID B</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Ic chip package and forming method</title><date>2010-12-29</date><risdate>2010</risdate><abstract>The present invention relates to an IC chip package and a forming method. A structure includes a solder element for electrically coupling a substrate of the integrated circuit (IC) chip package and a printed circuit board (PCB); and a first electrical property altering, substantially planar member positioned between the solder element and at least one of a landing pad of the substrate and a landing pad of the PCB. In another embodiment, the electrical property altering, planar member can be applied to the solder element(s) between the IC chip and the package substrate.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Ic chip package and forming method
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