Ic chip package and forming method

The present invention relates to an IC chip package and a forming method. A structure includes a solder element for electrically coupling a substrate of the integrated circuit (IC) chip package and a printed circuit board (PCB); and a first electrical property altering, substantially planar member positioned between the solder element and at least one of a landing pad of the substrate and a landing pad of the PCB. In another embodiment, the electrical property altering, planar member can be applied to the solder element(s) between the IC chip and the package substrate.