Soldering pin of wire jointing device for packaging semiconductor and wire jointing method

The invention discloses a soldering pin of a wire jointing device for packaging a semiconductor and a wire jointing method. The soldering pin comprises an insulation body and a preheating resistor layer. The insulation body is provided with a rod body part, a hole shrinkage part, a wire channel and a wire hole. The wire channel is arranged on the rod body part and the hole shrinkage part, and the wire hole is formed at the tail end of the hole shrinkage part and communicated with the wire channel for outputting a wire. The preheating resistor layer is provided with an anode part, a cathode part and a heat energy generating part. The anode part and the cathode part are respectively formed on different circumferential surfaces of the rod body part; the anode part and the cathode part respectively extend to the hole shrinkage part from the rod body part and are mutually connected on the hole shrinkage part to form the heat energy generating part; and the heat energy generating part is close to the wire hole.