Driver module structure
Provided is a driver module structure which can ensure high reliability. A PDP driver device (1) is provided with a flexible substrate (2) wherein a wiring pattern is formed, a semiconductor device (3) mounted on the flexible substrate (2), and a heat dissipating body (4) having a recessed section (...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | Provided is a driver module structure which can ensure high reliability. A PDP driver device (1) is provided with a flexible substrate (2) wherein a wiring pattern is formed, a semiconductor device (3) mounted on the flexible substrate (2), and a heat dissipating body (4) having a recessed section (41) formed thereon for storing the semiconductor substrate (3). The heat dissipating body (4) is provided with four grooves (8), each of which has a substantially V-shaped cross-section, as ventilation paths for connecting a space inside the recessed section (41) with the external. |
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