Steel mesh and PCB (Printed Circuit Board)

The invention discloses a steel mesh which is provided with a plurality of holes, wherein at least one protrusion is arranged in one hole. The invention also discloses a PCB (Printed Circuit Board) which is provided with a plurality of bonding pads, wherein the bonding pads are provided with at least one notch, and the shape of each hole of the steel mesh is matched with the shape of each bonding pad. Limited by the protrusions in the steel mesh holes, the quantity of dipped solder paste is reduced to achieve the aim of reducing the consumption of the solder paste at the bottom of an element or a device, the internal flowing of the solder paste is lessened by the reduced consumption of the solder paste so that the surface tension of the element or the device is balanced to avoid adverse phenomena, such as tin wires and tombstones generated at the bottom of the element or the device, the rotating position offset of the element or the device during the reflow, and the like.