Packaged semiconductor and production method thereof

The invention discloses a packaged semiconductor and a production method thereof. The production method comprises the steps of: firstly, providing a carrier plate; secondly, setting chips on the carrier plate; thirdly, cladding the chips with sealant so as to ensure that the sealant and the chips form a sealant body full of chips; fourthly, removing the carrier plate to expose a chip connection pad of the sealant body full of chips; fifthly, acting the joint pad and the sealant by using plasmas to rough the surface of the joint pad and the sealant; sixthly, forming a first dielectric layer onthe surfaces of the joint pad and the sealant; eighthly, acting the surface of the first dielectric layer with the plasmas to rough the surface; ninthly, forming a patterned conductive layer on the surface of the first dielectric layer; tenthly, forming a second dielectric layer on the patterned conductive layer and the first dielectric layer; eleventhly, forming solder balls on the second dielectric layer; and finally, c