High-frequency and high-Q-value chip multilayer ceramic capacitor

The invention discloses a high-frequency and high-Q-value chip multilayer ceramic capacitor. The capacitor is prepared by the steps of preparing ceramic paste, preparing a medium membrane, overprinting, drying a compact, laminating, cutting, discharging an adhesive, firing, chamfering, sealing an end, sintering the end, electroplating and the like, wherein an inner electrode is made of nickel (Ni) during the overprinting of the inner electrode and a medium layer; an end electrode is made of copper (Cu) during the end sealing; the used ceramic material is a zirconium-titanium-strontium-calcium (Ca-Sr-Ti-Zr) series ceramic material during the preparation of the ceramic paste; the Ca-Sr-Ti-Zr series ceramic material is spheres or approximately spherical bodies with average particle size of 0.3 to 0.5 mu m; and the inner electrode is arranged by using inverted overprinting during the overprinting of the inner electrode and the medium layer. The prepared chip multilayer ceramic capacitor has superior high-frequenc