Electroplating rack and electroplating device for printed circuit board

The invention relates to relevant technical field of printed circuit boards, in particular to an electroplating rack and an electroplating device for a printed circuit board. The electroplating rack for the printed circuit board comprises an upper end part, wherein the upper end part is fixedly connected with an electroplating tow glider, provided with a fixing device for fixing the circuit board and connected with a lower end part through a supporting device; and the lower end part is provided with a clamping device for clamping the printed circuit board and a front baffle plate and a back baffle plate which are parallel to the clamping device. The electroplating rack of the invention greatly reduces the crease producing probability of an electroplated part. Moreover, dense power lines at a lower end are shielded by a lower end baffle plate so that the current density of the lower end is almost accordant with that of an upper end and the electroplating effect is improved greatly. The electroplating rack can