High-temperature resistant structural adhesive and preparation method thereof

The invention discloses a high-temperature resistant structural adhesive and a preparation method thereof. The high-temperature structural adhesive is prepared by compounding aromatic series multi-element primary amine and poly-functional group epoxy resin, wherein the mass ratio of the aromatic ser...

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Bibliographische Detailangaben
Hauptverfasser:	TANG GENGPING, YANG YONGFENG, CHENG HAIFENG, XING XIN, CHU ZENGYONG, ZHANG CHAOYANG, ZHOU YONGJIANG, ZHENG WENWEI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The invention discloses a high-temperature resistant structural adhesive and a preparation method thereof. The high-temperature structural adhesive is prepared by compounding aromatic series multi-element primary amine and poly-functional group epoxy resin, wherein the mass ratio of the aromatic series multi-element primary amine to the poly-functional group epoxy resin 30-90:10-30. A preparationprocess of the high-temperature resistant structural adhesive is simple, the usage temperature is high, and the maximum usage temperature can reach 400 DEG C; the high-temperature bonding strength ishigh, the room temperature bonding strength (butt-joint and pull-apart method) after high-temperature curing reaches 30 to 40 MPa, the bonding strength at 250 DEG C reaches 6 to 7 MPa, and the bonding agent at 350 DEG C reaches 3 to 4 MPa; and all used raw materials are commercial products which are cheap and easy to get.