A method and apparatus for semiconductor processing

The present invention discloses a mechanism and a method for wafer transmission. The wafer transmission mechanism comprises the following components: a container; a first gate valve which is connected with the container and is configured to connect with a vacuum chamber and is connected with a secon...

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Bibliographische Detailangaben
Hauptverfasser:	PRICE J. B, DULMAGE LAURENCE, KELLER JED
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The present invention discloses a mechanism and a method for wafer transmission. The wafer transmission mechanism comprises the following components: a container; a first gate valve which is connected with the container and is configured to connect with a vacuum chamber and is connected with a second gate valve that is provided on the container and is configured to connect with a processing chamber; a rotating mechanism which is provided in the container; a first linear driving mechanism which is connected with the rotating mechanism and is configured to a state that a first blade for supporting the wafer extends through one selected from the first gate valve and the second gate valve; and a second linear driving mechanism which is connected with a rotating mechanism and is configured to a state that a second blade for supporting the wafer extends through the other opposite gate valve in the first gate valve and the second gate valve; wherein, the operation of the first linear driving mechanism and the second