Low application temperature hot melt adhesive composition and articles including the same
A hot melt adhesive composition that includes a first tackifying agent that includes phenol-modified aromatic hydrocarbon resin, thermoplastic polymer that includes ethylene copolymer, and a first wax.
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | A hot melt adhesive composition that includes a first tackifying agent that includes phenol-modified aromatic hydrocarbon resin, thermoplastic polymer that includes ethylene copolymer, and a first wax. |
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