Methods and apparatuses for transferring articles through a load lock chamber under vacuum

Methods and apparatuses for transferring articles through a load lock chamber under vacuum

Methods and apparatuses directed to vacuum-assisted processing of articles are disclosed whereby the articles are directed between staging chamber (15) and a processing chamber (11) with both chambers maintained at substantially equivalent low pressures to enhance system efficiency and product quali...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: EREZ SHMUEL, SAJJAD BASHA S, SENGUPTA SUBHASHISH, SIN PHENG, KRONEBERGER CRIS KEITH
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
DIFFUSION TREATMENT OF METALLIC MATERIAL
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
METALLURGY
MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE
SEMICONDUCTOR DEVICES
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:Methods and apparatuses directed to vacuum-assisted processing of articles are disclosed whereby the articles are directed between staging chamber (15) and a processing chamber (11) with both chambers maintained at substantially equivalent low pressures to enhance system efficiency and product quality, and wherein magnetic coupled drive mechanisms (43) are used to locate the article before and after processing.