High temperature resistant modified epoxy resin, preparation method thereof and use thereof

The invention discloses a high temperature resistant modified epoxy resin, a preparation method thereof and use thereof. The high temperature resistant modified epoxy resin is produced by performing a modification reaction of polymethyl silicone and bisphenol A epoxy resin at 100 to 180 DEG C for 8...

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Bibliographische Detailangaben
Hauptverfasser:	TANG GENGPING, CHENG HAIFENG, XING XIN, CHU ZENGYONG, ZHANG CHAOYANG, ZHOU YONGJIANG, ZHENG WENWEI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON CORRECTING FLUIDS DYES FILLING PASTES INKS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING PERFORMING OPERATIONS POLISHES PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SPRAYING OR ATOMISING IN GENERAL THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	The invention discloses a high temperature resistant modified epoxy resin, a preparation method thereof and use thereof. The high temperature resistant modified epoxy resin is produced by performing a modification reaction of polymethyl silicone and bisphenol A epoxy resin at 100 to 180 DEG C for 8 to 24 hours in the absence of the air. A resin material obtained by curing the modified epoxy by using a common amine curing agent can resist a temperature above 350 DEG C, has a coating adhesive force of 8 to 15MPa and is greatly improved in flexibility and impact resistance.