Electronic component mounting apparatus

An electronic component mounting apparatus 1 includes a substrate conveyance mechanism 14 for conveying substrates 13 and 13a; a first drawing head 4 for supplying the substrate 13 with paste at a mounting position; a second drawing head 5 for supplying the paste to the substrate 13a at a pre-paste...

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Bibliographische Detailangaben
1. Verfasser:	SHIMOYOSHI MITSUAKI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	An electronic component mounting apparatus 1 includes a substrate conveyance mechanism 14 for conveying substrates 13 and 13a; a first drawing head 4 for supplying the substrate 13 with paste at a mounting position; a second drawing head 5 for supplying the paste to the substrate 13a at a pre-paste supply position closer to a conveyance starting side rather than to the mounting position; and a bonding head 3 that mounts, at the mounting position, electronic components on the substrate 13 supplied with the paste at the pre-paste supply position.