Solder pad and packaging structure applying same

Solder pad and packaging structure applying same

The invention relates to a solder pad and a packaging structure applying the same. The solder pad comprises a metal substrate, a hard metal layer and an antioxidant metal layer, wherein the hard metal layer is arranged on the metal substrate, the hardness of materials of the hard metal layer is larg...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HONG CHANGYING, WENG ZHAOFU, CAI ZONGYUE, GAO RENJIE
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:The invention relates to a solder pad and a packaging structure applying the same. The solder pad comprises a metal substrate, a hard metal layer and an antioxidant metal layer, wherein the hard metal layer is arranged on the metal substrate, the hardness of materials of the hard metal layer is larger than that of the metal substrate, the antioxidant metal layer is arranged on the hard metal layer, and the activity of materials of the antioxidant metal layer is lower than that of the hard metal layer.