Load lock apparatus and substrate cooling method

Load lock apparatus and substrate cooling method

Load lock apparatuses (6, 7) are provided with a container (31) arranged to vary a pressure between a pressure which corresponds to a vacuum transfer chamber (5) and an atmospheric pressure; a pressure adjusting mechanism (49), which adjusts the pressure inside the container (31) to vacuum which cor...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: YAMAZAKI RYOJI
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
DIFFUSION TREATMENT OF METALLIC MATERIAL
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
METALLURGY
SEMICONDUCTOR DEVICES
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:Load lock apparatuses (6, 7) are provided with a container (31) arranged to vary a pressure between a pressure which corresponds to a vacuum transfer chamber (5) and an atmospheric pressure; a pressure adjusting mechanism (49), which adjusts the pressure inside the container (31) to vacuum which corresponds to the transfer chamber (5) and to the atmosphere; a lower cooling plate (32) and an uppercooling plate (33), which are arranged to face each other in the container (31) and cool a wafer (W) by being in proximity to or in contact with the wafer (W); a wafer lifting pin (50) and a driving mechanism (53), which transfer the wafer (W) to a cooling position of the lower cooling plate (32); and a wafer supporting member (60) and a driving mechanism (63), which transfer the wafer (W) to a cooling position of the upper cooling plate (33).