Semiconductor process equipment and O-shaped ring thereof

The invention relates to semiconductor process equipment and an O-shaped ring thereof. The equipment is used for implementing process on a wafer and comprises a wafer seat and an O-shaped ring, wherein the wafer seat comprises a wafer seat main body, a fluid supplying unit and a bearing element. The bearing element is arranged on the bearing element. The fluid supplying unit is arranged in the wafer seat main body and provides fluid to the wafer. A channel is formed on the connecting part of the wafer seat main body and the bearing element, which is arranged on the wafer seat side of the wafer seat. The O-shaped ring is arranged in the channel. By arranging ribs, the radial strength of the O-shaped ring can be intensified, and the O-shaped ring is prevented from generating flexure in radial direction. In addition, by properly setting the ratio of the radial thickness of the main body to the radial thickness of the rib, the invention can simultaneously provide sufficient flexure-prevention and sealing effects.