Lead support frame for binary division lead deicing through mechanical shock

The invention relates to a lead support frame for a binary division lead deicing through mechanical shock, comprising an icebreaking head and a clamping part which are mutually connected, wherein the clamping part is in a V-shaped or U-shaped structure and comprises an installing table, a left suppo...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HU DANHUI, LI ZHENZHU, SHI TIANRU, CHEN JIDONG, WANG JIALI, WU BOHUA, ZHENG JUNJIE, TU CAIQI, HU RAN, TAO SIWEI, ZHANG YU, ZHANG CHONGFEI
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention relates to a lead support frame for a binary division lead deicing through mechanical shock, comprising an icebreaking head and a clamping part which are mutually connected, wherein the clamping part is in a V-shaped or U-shaped structure and comprises an installing table, a left supporting part and a right supporting part; the left supporting part and the right supporting part are arranged on the installing table and are mutually symmetrical; the top ends of the left supporting part and the right supporting part are respectively provided with a left wiring part and a right wiring part; a left included angle and a right included angle which are formed between the left supporting part and the right supporting part are 10-180 degrees; the top ends of the left supporting part and the right supporting part are provided with the left wiring part and the right wiring part which are mutually symmetrical; and the left wiring part and the right wiring part are respectively provided with a groove. The inv