Packaging substrate structure and manufacturing method thereof

The invention relates to a packaging substrate structure and a manufacturing method thereof. The manufacturing method of the packaging substrate comprises the following steps of: providing a semiconductor base plate which is provided with one surface; forming a first etching mask on the surface of the semiconductor base plate, wherein the first etching mask is provided with an etching window which has a side wall extending along a first direction, an excursion angle exists between the first direction and the crystal lattice direction of the semiconductor base plate, and the excursion angle ismore than zero degree and less than 45 degrees or no more than 90 degrees but more than 45 degrees; carrying out selective non-isotropic etching on the semiconductor base plate by applying the first etching mask and the etching window, and further etching an inclined plane on the surface of the semiconductor base plate along the first direction; forming a second etching mask on the inclined plane, wherein the second etchi