Demountable heat dissipating packaging structure of middle bus converter

The invention relates to a demountable heat dissipating packaging structure of a middle bus converter, which comprises an annular fixing frame and a radiator arranged on the fixing frame in a demountable mode; by the design, the radiator can be cooperated with the heat dissipating environment in the...

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Bibliographische Detailangaben
Hauptverfasser:	SUN YUKUN, LIN BAIHAO, CAI ZONGYOU
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	The invention relates to a demountable heat dissipating packaging structure of a middle bus converter, which comprises an annular fixing frame and a radiator arranged on the fixing frame in a demountable mode; by the design, the radiator can be cooperated with the heat dissipating environment in the interior of a server shell arranged in the middle bus converter to be regulated and replaced so that the heat dissipating packaging structure has good heat dissipating effect and the whole middle bus converter does not need to be dismounted and replaced; and simultaneously, the structure can achieve the purpose of being convenient for the design of the heat dissipating environment, maintaining and reducing the maintaining cost.