Ultrasonic processing method for enhancing size accuracy of micro-electroformed apparatus
The invention relates to an ultrasonic processing method for enhancing the size accuracy of a micro-electroformed apparatus, belongs to the technical field of micro-manufacturing and particularly relates to a method for enhancing the size accuracy of the micro-electroformed apparatus. A process for...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to an ultrasonic processing method for enhancing the size accuracy of a micro-electroformed apparatus, belongs to the technical field of micro-manufacturing and particularly relates to a method for enhancing the size accuracy of the micro-electroformed apparatus. A process for manufacturing the micro-electroformed apparatus comprises the following processes: performing pretreatment on a nickel substrate, manufacturing a micro-electroformed rubber mold and performing micro-electroforming. In the process of manufacturing the micro-electroformed rubber mold, the nickel substrate coated with SU-8 rubber is fixed on an ultrasonic workbench after whirl coating, prebaking, photo-etching and after-baking are performed, is ultrasonically vibrated and developed to obtain the micro-electroformed rubber mold. The micro-electroformed rubber mold is soaked into electrotyping solution and is subjected to electro-deposition in a groove of the micro-electroformed rubber mold to form a nickel-electroforme |
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