Stacked multi-encapsulation structure device, semiconductor encapsulation structure and manufacturing method thereof

The invention relates to a semiconductor encapsulation structure which comprises a baseplate, a chip and a sealant compound; wherein the baseplate contains a plurality of electric contacts which are positioned on the upper surface of the baseplate; the chip is fixedly and electrically connected to t...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: WENG CHENGYI, ZHU JIZHI, LIAO ZHENKAI
Format: Patent
Sprache:chi ; eng
Schlagworte:
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