Stacked multi-encapsulation structure device, semiconductor encapsulation structure and manufacturing method thereof

The invention relates to a semiconductor encapsulation structure which comprises a baseplate, a chip and a sealant compound; wherein the baseplate contains a plurality of electric contacts which are positioned on the upper surface of the baseplate; the chip is fixedly and electrically connected to the upper surface of the baseplate; and the sealant compound covers the baseplate and the chip and exposes out of the lower surface of the baseplate, wherein the sealant compound contains a plurality of openings, and each opening encloses and exposes out of each electric contact.