Substrate and chip package structure

The invention discloses a substrate for carrying a chip and a chip package structure. The substrate comprises a first surface and a lead layer, wherein the lead layer is arranged on the first surface, and at least one region without wiring is formed on the lead layer. When the chip is carried by the...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LU DONGBAO, LIN YAFEN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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