Light-emitting diode (LED) illumination module and encapsulation method

The invention discloses a light-emitting diode (LED) illumination module and an encapsulation method. In the LED encapsulation process of the LED illumination module, the light distribution requirement of the lamp is considered, the pins of an LED lead rack are bent so that an LED chip can have diff...

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Bibliographische Detailangaben
Hauptverfasser:	LAI JIELONG, LU WENRONG, HUANG YIPING, TU YAJUN, LIN JIANXIAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF HEATING INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21Sand F21V, RELATING TO THEFORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THELIGHT EMITTED LIGHTING MECHANICAL ENGINEERING NON-PORTABLE LIGHTING DEVICES SEMICONDUCTOR DEVICES STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR SYSTEMS THEREOF VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLEEXTERIORS WEAPONS
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Beschreibung
Zusammenfassung:	The invention discloses a light-emitting diode (LED) illumination module and an encapsulation method. In the LED encapsulation process of the LED illumination module, the light distribution requirement of the lamp is considered, the pins of an LED lead rack are bent so that an LED chip can have different inclination angles and further generate different illumination effects, and the LED module can lessen the reliance on a light control element and be directly applied to the LED illumination module. Meanwhile, a plurality of LED chips can be mounted on a board and aligned by one step so that light distribution curves are not deflected, and the on-board process is rapid.