Efficiently cool data centers and electronics housed in electronics

Disclosed in the present invention are ways for cooling components contained in enclosures that reject 500 or more Watts employing two phase passive heat transfer devices including Loop Heat Pipes and devices we refer to as LHPLs. The methods minimize the amount of energy employed in cooing while at the same time maximizing the quality of heat rejected to the secondary cooling loops that transmit the heat to the outside world. Where data centers provide direct access to chilled water it becomes possible to reject heat directly to cooling towers in locations as hot and humid as Atlanta Georgia eliminating 40% or more of the total energy consumed. The key advances that make this energy efficient performance employ LHPLs that have the smallest possible total thermal resistance, methods that maximize their effectiveness and ancillary devices that minimize the energy consumed in move cooling air.