Method for producing an electronic component and electronic component

The invention relates to a method for producing an electronic component (100), wherein a plurality of chips (3) disposed in a wafer on a passivated main side having at least one chip contact surface (4, 5) is provided with an insulation layer (7). The insulation layer (7) has openings (12) in the ar...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WEIDNER KARL, HOFFMANN WERNER, SCHWARZBAUER HERBERT, HOEFER ROLAND
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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