Method for producing an electronic component and electronic component

Method for producing an electronic component and electronic component

The invention relates to a method for producing an electronic component (100), wherein a plurality of chips (3) disposed in a wafer on a passivated main side having at least one chip contact surface (4, 5) is provided with an insulation layer (7). The insulation layer (7) has openings (12) in the ar...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: WEIDNER KARL, HOFFMANN WERNER, SCHWARZBAUER HERBERT, HOEFER ROLAND
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:The invention relates to a method for producing an electronic component (100), wherein a plurality of chips (3) disposed in a wafer on a passivated main side having at least one chip contact surface (4, 5) is provided with an insulation layer (7). The insulation layer (7) has openings (12) in the area of the at least one chip contact surface (4, 5) of each chip (3). The chip contact surfaces (4, 5) of each chip (3) are provided with a chip contact surface metallization (8, 9) of a prescribed thickness, and the chips disposed in the wafer (3) are separated therefrom.