Wireless transceiver module

The invention relates to a wireless transceiver module, which is provided with a plurality of through holes. The wireless transceiver module comprises a wireless network chip, a first circuit substrate, a Bluetooth chip and a plurality of conductive connecting structures, wherein the Bluetooth chip is configured between the first circuit substrate and the wireless network chip, the through holes run through the wireless network chip, the first circuit substrate and the Bluetooth chip; the plurality of conductive connecting structures are configured in the through holes respectively and electrically connecting the Bluetooth chip, the wireless network chip and the first circuit substrate. Thus, the wireless transceiver module can reduce the area occupied by the electronic elements thereof on the substrate.