Structure of semiconductor packaging piece and manufacture method thereof

The invention relates to structure of a semiconductor packaging piece and manufacture method thereof. The structure comprises a reinforcement piece, a plurality of guide feet, a substrate and a chip, wherein the reinforcement piece is provided with a first surface and a second surface which are oppo...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HUANG JIANPING, ZHAN CHANGYUE, HUANG ZHIMING, ZHANG JINHUANG
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention relates to structure of a semiconductor packaging piece and manufacture method thereof. The structure comprises a reinforcement piece, a plurality of guide feet, a substrate and a chip, wherein the reinforcement piece is provided with a first surface and a second surface which are opposite and an opening; the guide feet are connected to the first surface of the reinforcement piece; the substrate is connected to the second surface of the reinforcement piece and provided with an upper surface and a lower surface which are opposite; and the chip is connected to the partial substrate exposed from the opening. The manufacture method comprises the following steps of: electrically connecting the chip to the substrate and the guide feet in a mode of welding lines; and carrying out packaging and mould pressing operations to form a packaging glue body cladding the substrate, the chip, the reinforcement piece and the guide feet, wherein the packaging glue body is aligned to the lower surface of the substra