Circuit board manufacturing method through coverage

The invention discloses a circuit board manufacturing method through coverage, which is applied to the circuit board manufacturing environment. The circuit board manufacturing method through coverage comprises the following procedures: manufacturing shallow blind hole type micro holes on the colloid...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HU ZIJIAN, SHI HANQING, YANG WEIXIONG, YANG DIWEI
Format: Patent
Sprache:chi ; eng
Schlagworte:
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Beschreibung
Zusammenfassung:The invention discloses a circuit board manufacturing method through coverage, which is applied to the circuit board manufacturing environment. The circuit board manufacturing method through coverage comprises the following procedures: manufacturing shallow blind hole type micro holes on the colloid surface of a plated conductive hole filled with the colloid in a physical mode, wherein the platedconductive hole filled with the colloid is positioned in the circuit board; and performing a copper plating procedure on the circuit board at the periphery of the plated conductive hole and the colloid surface with the micro holes. When the copper plating procedure is finished, a second copper layer is attached to the colloid surface and on a first copper layer at the periphery of the plated conductive hole; and a downward protrusion of the second copper layer is tightly combined with the micro holes of the colloid surface, so that the adhesive force between the colloid surface and the secondcopper layer plated and at