Method for encapsulating piezoelectric polymer thin-film sensor

The invention relates to a method for encapsulating a piezoelectric polymer thin-film sensor, which comprises the following steps of: cutting micropore structure crosslinked polypropylene (XPP) membrane into the membrane with a size of 1cm*5cm; depositing metal electrodes on the two surfaces of the...

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Bibliographische Detailangaben
Hauptverfasser: MENG ZHAOLONG, GONG XIANGSHAN, SUN ZHUANLAN, ZHANG XIAOQING
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention relates to a method for encapsulating a piezoelectric polymer thin-film sensor, which comprises the following steps of: cutting micropore structure crosslinked polypropylene (XPP) membrane into the membrane with a size of 1cm*5cm; depositing metal electrodes on the two surfaces of the XPP membrane through vapor after a charging process; adhering metal wires (1) on the upper and lower surfaces of the XPP membrane through conductive adhesive to form the piezoelectric polymer thin-film sensor (3); placing the piezoelectric polymer thin-film sensor (3) into an encapsulating thin film (2) of which the melting point is less than that of the XPP membrane to vacuumize; adjusting the temperature of a thermocompressor to the melting point of the encapsulating thin film (2); and adhering the vacuumized piezoelectric polymer thin-film sensor (3) with the encapsulating thin film (2) into a whole. The method for encapsulating the piezoelectric polymer thin-film sensor is simple in process and low in cost and