Solidified abrasive grinding and polishing pad with transition layer and bonding layer

The invention relates to a solidified abrasive grinding and polishing pad with a transition layer and a bonding layer, which comprises an abrasive layer (1), a rigid layer (4) and/or an elastic layer (5), wherein the abrasive layer (1) is positioned on the rigid layer (4), and the rigid layer (4) is positioned above the elastic layer (5). The solidified abrasive grinding and polishing pad is characterized in that a transition layer (2) and a bonding layer (3) are also arranged between the abrasive layer (1) and the rigid layer (4), the abrasive layer (1) is solidified on the transition layer (2), and the transition layer (2) is directly connected with the rigid layer (4) or the elastic layer (5) by the bonding layer (3). The invention is beneficial to enhancing the bonding force of the abrasive layer and the rigid layer and/or the elastic layer and has a certain toughness. Compared with the grinding and polishing pad with the same type and without the transition layer and the bonding layer, the service life o