Method for preparing icing-resistant copper surface with super hydrophobicity and low adhesiveness

The invention discloses a method for preparing an icing-resistant copper surface with super hydrophobicity and low adhesiveness, comprising the steps: jetting sand to the copper surface with micron-sized sand pill to construct a micron-sized coarse structure, wherein mesh number of the sand pill is 36-150 meshes, pressure of air flow is 0.2-0.8MPa, and jetting time is 1-5 min; immersing the cleaned and dried sand-jetted copper surface into mixed water solution under 50-90 DEG C, taking off and cleaning with clean water after water bathing for 20-60 min, and drying in a thermostatic oven for 0.5-2 hours under 150-200 DEG C to obtain a micro/nano composite structure at the copper surface, wherein mixed water solution comprises potassium persulfate and potassium hydroxide, the molar concentration of the potassium persulfate is 0.04-0.3 mol/L, and the molar concentration of the potassium hydroxide is 1-4 mol/L; and evaporating and plating the copper plate with micro/nano structure in alcohol solution of fluorosil