Lead structure applied inside micro piezoelectric pump

The invention relates to an electrically connecting structure applied to a micro piezoelectric pump, comprising a driving circuit board and a lead structure consisting of a plurality of single layers.The electrically connecting structure sequentially comprises the driving circuit board, the lead structure and piezoelectric patches from top to bottom. The driving circuit board is provided with a driving circuit which is used for driving the piezoelectric patches and at least more than one electrically connecting point, wherein the electrically connecting points are electrically connected withthe driving circuit. The piezoelectric patches are arranged on the same surface on which a first electrode contact area and a second electrode contact area which are mutually and electrically isolatedare arranged. The lead structure is used for transmitting signals of the electrically connecting points to the first electrode contact area and the second electrode contact area.