Display module, liquid crystal display device and method for manufacturing display module

A liquid crystal display module (10) in accordance with the present invention includes a liquid crystal display module provided with a liquid crystal display panel (11), an external circuit substrate(13) and a film-shaped flexible print substrate (14) connected to an edge of the circuit substrate. I...

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Bibliographische Detailangaben
Hauptverfasser:	KUSAKAI SUGURU, MINAMINO KOHJI, KAWAGUCHI HISAO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADVERTISING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CRYPTOGRAPHY DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING DISPLAY DISPLAYING EDUCATION ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FREQUENCY-CHANGING LABELS OR NAME-PLATES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS PRINTED CIRCUITS SEALS SIGNS TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
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Beschreibung
Zusammenfassung:	A liquid crystal display module (10) in accordance with the present invention includes a liquid crystal display module provided with a liquid crystal display panel (11), an external circuit substrate(13) and a film-shaped flexible print substrate (14) connected to an edge of the circuit substrate. In the liquid crystal display module, a source driver 1C (21) is mounted, by COF mounting, between aTFT substrate (17) and an external circuit substrate (13). In the flexible print substrate (14), a connector (22) to connect together an external connection terminal (24) on the external circuit substrate (13) and an external connection terminal (23) on the flexible print substrate (14) is provided. The connector (22) is furnished so as to sandwich an edge of the external circuit substrate (13).This way, it is possible to conduct a connection of the circuit substrate and of the flexible substrate easily, and to achieve a complete automation of the assembly line.