Production method and device of surface roughened copper plate, and surface roughened copper plate

The invention provides a method for roughening the both sides of a copper plate by forming minute nodular protrusions on the both sides of the copper plate in which progress of deterioration of electrolytic copper plating liquid is retarded. Electrodes (3, 3) of the same polarity are arranged opposi...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ISHIHAMA SADAO, WATANABE HAJIME, YAMAMOTO KIYOTERU, OYOSHI TOSHIHIRO, IMAI TAKAHIRO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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