Production method and device of surface roughened copper plate, and surface roughened copper plate

The invention provides a method for roughening the both sides of a copper plate by forming minute nodular protrusions on the both sides of the copper plate in which progress of deterioration of electrolytic copper plating liquid is retarded. Electrodes (3, 3) of the same polarity are arranged oppositely in electrolytic copper plating liquid (2) and a copper plate (4) is arranged between. At first, anodization for generating fine copper particles on the both sides of the copper plate (4) by electrolysis using the copper plate (4) as a positive electrode and the electrodes (3, 3) as a negative electrode is carried out. Thereafter, cathode processing for fixing the fine copper particles to the surface of the copper plate (4) by electrolytic plating using the copper plate (4) as a negative electrode and the electrodes (3, 3) as a positive electrode is carried out. Minute nodular protrusions are formed by performing anodization and cathode processing one cycle or more.