Side view light emitting diode package

A side view LED package for a backlight unit includes a package body having a cavity with an inner sidewall inclined between a bottom and a top; first and second lead frames arranged in the package body, the cavity of the package body exposing a portion of at least one of the first and second lead frames placed in the bottom of the cavity to outside; a light emitting diode chip mounted on the bottom of the cavity to be electrically connected to the first and second lead frames; and at least one lead for electrically connecting the light emitting diode chip to at least one of the first and second lead frames. The lead is arranged in such a fashion that a height from a top surface of the light emitting diode chip to a top end of the wire is 100 [mu]m or less and the installation height of the light emitting diode chip is 50 [mu]m to 200 [mu]m and the depth of the cavity is 200 [mu]m to 480 [mu]m. Therefore the beam angle characteristics of emission light is improved, the light quantity is increased and a moldin